What are the performance characteristics of the 3240 epoxy board?

Many friends in the industry often consult the problem. Today, I mainly share with you my personal point of view. Interested and then look down.
1, in various forms. Various resins, curing agents, modifier systems can be adapted to a wide range of applications to the requirements of the form, ranging from very low viscosity to high melting solids.
2, easy to cure. Choose a variety of curing agent, epoxy resin system can be almost 0 ~ 180 ℃ temperature range curing.
3, strong adhesion. The presence of polar hydroxyl and ether linkages inherent in the molecular chain of the mica insulation sheets gives it a high adhesion to various substances. Epoxy resin curing low shrinkage, the resulting internal stress is small, which also helps to improve the adhesion strength.
4, low shrinkage The reaction of the epoxy resin and the curing agent used is carried out by a direct addition reaction or by ring-opening polymerization of an epoxy group in the resin molecule without the presence of water or other volatile by-products. They exhibit very low shrinkage (less than 2%) compared to unsaturated polyester resins and phenolic resins during curing.